Green sic micropowder for semiconductor cutting mortar
Green sic micropowder for semiconductor cutting mortar is an extremely hard (Knoop 2600 or Mohs 9.4) man made mineral that possesses high thermal conductivity (100 W/m-K). It also has high strength at elevated temperatures (at 1000°C, Green SiC is 7.5 times stronger than Al2O3). Green SiC has a modulus of elasticity of 410 GPa, with no decrease in strength up to 1600°C, and it does not melt at normal pressures but instead dissociates at 2815.5°C.
PHYSICAL PROPERTIES
| Specific Weight | 3.95 g/ cm3 |
| Mohs Hardness | 9.5 |
| Maximum service temperature | 1900℃ |
| Melting Point | 2250℃ |
TYPICAL CHEMICAL ANALISIS [%]
| SiC | Fe2O3 | F.C | F.Si | SiO2 | LOI |
| 98.0-99.5 | ≤0.15 | ≤0.30 | ≤0.40 | ≤0.70 | < 0.09 |
PARTICLE SIZE DISTRIBUTION
CHAPTER Ⅰ（JIS STANDARD）
| Size | DO(um) | D3(um) | D50(um) | D94(um) |
| #240 | ≤127 | ≤103 | 57.0±3.0 | ≥40 |
| #280 | ≤112 | ≤87 | 48.0±3.0 | ≥33 |
| #320 | ≤98 | ≤74 | 40.0±2.5 | ≥27 |
| #360 | ≤86 | ≤66 | 35.0±2.0 | ≥23 |
| #400 | ≤75 | ≤58 | 30.0±2.0 | ≥20 |
| #500 | ≤63 | ≤50 | 25.0±2.0 | ≥16 |
| #600 | ≤53 | ≤41 | 20.0±1.5 | ≥13 |
| #700 | ≤45 | ≤37 | 17.0±1.5 | ≥11 |
| #800 | ≤38 | ≤31 | 14.0±1.0 | ≥9.0 |
| #1000 | ≤32 | ≤27 | 11.5±1.0 | ≥7.0 |
| #1200 | ≤27 | ≤23 | 9.5±0.8 | ≥5.5 |
| #1500 | ≤23 | ≤20 | 8.0±0.6 | ≥4.5 |
| #2000 | ≤19 | ≤17 | 6.7±0.6 | ≥4.0 |
| #2500 | ≤16 | ≤14 | 5.5±0.5 | ≥3.0 |
| #3000 | ≤13 | ≤11 | 4.0±0.5 | ≥2.0 |
| #4000 | ≤11 | ≤8.0 | 3.0±0.4 | ≥1.8 |
| #6000 | ≤8.0 | ≤5.0 | 2.0±0.4 | ≥0.8 |
| #8000 | ≤6.0 | ≤3.5 | 1.2±0.3 | ≥0.6 |
CHAPTER Ⅱ（FEPA STANDARD）
| Size | D3(um) | D50(um) | D94（um) |
| F230 | ＜82 | 53.0±3.0 | >34 |
| F240 | ＜70 | 44.5±2.0 | >28 |
| F280 | ＜59 | 36.5±1.5 | >22 |
| F320 | ＜49 | 29.2±1.5 | >16.5 |
| F360 | ＜40 | 22.8±1.5 | >12 |
| F400 | ＜32 | 17.3±1.0 | >8 |
| F500 | ＜25 | 12.8±1.0 | >5 |
| F600 | ＜19 | 9.3±1.0 | >3 |
| F800 | ＜14 | 6.5±1.0 | >2 |
| F1000 | ＜10 | 4.5±0.8 | >1 |
| F1200 | ＜7 | 3.0±0.5 | >1(at 80%) |
| F1500 | ＜5 | 2.0±0.4 | >0.8(at 80%) |
| F2000 | ＜3.5 | 1.2±0.3 | >0.5(at 80%) |
Mainly Applications
-Bonded Abrasives and Coated abrasives
-Blasting,surface Treatment,Rust Removal
-Wet and dry blast media,grinding and polishing etc
-Floor/Wall laminates,Wear-resistant
-Ceramic products: Ceramic and Tiles,Ceramic filter plate,ceramic membrane etc
-Teflon painting etc
– Heat insulating material
-Grinding wheels,Cup wheels,Whetstone,polishing pads etc
-Used for crucibles, parts for kiln burning, mechanical seals, and parts materials to produce semiconductors
Package for green sic silicon carbide:
- 25KG small bags
- Small bags + pallet
